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Há 2 dias · AMD 3D IC Devices; Virtex UltraScale+: XCVU5P: XCVU7P: XCVU9P: XCVU11P: XCVU13P: XCVU19P: XCVU27P: XCVU29P: XCVU31P: XCVU33P: XCVU35P: XCVU37P: XCVU45P: XCVU47P: XCVU57P: Virtex UltraScale: XCVU125: XCVU160: XCVU190: XCVU440 Kintex UltraScale: XCKU085: XCKU115 Virtex 7 T: 7V2000T Virtex 7 XT: 7VX1140T
Há 3 dias · 3D IC packages boost performance even further by using much shorter interconnect wire lengths by stacking components vertically, enabling ultra-high vertical interconnect density with lower parasitics while saving massive amounts of on-chip real estate. 3D IC: X-Cube™ technology dramatically reduces yield risks from large ...
Há 2 dias · Tessent provides design steps to insert test logic for each die, mechanism to access individual die, to perform die-die interconnect test and so on. In 2.5D IC, we insert DFT logic in the dies, make the whole package compliant with IEEE 1149.1 standard, as well as insert the Boundary Scan in the die in order to improve the Boundary Scan performance after integration to the package.
Há 1 dia · From the introduction of high-density interconnect (HDI) substrates to the adoption of advanced packaging technologies like System-in-Package (SiP) and 3D packaging, innovation is driving the evolution of IC substrates, opening up new opportunities and markets. 3. Demand From Emerging Technologies
Há 18 horas · Eric Beyne, senior fellow, VP of R&D, and program director 3D system integration at imec: “In terms of interconnect pitch, die-to-wafer hybrid bonding can now bridge the gap between solder-based die-to-wafer bonding (which is likely to stagnate at 10 to 5µm bump pitch) and wafer-to-wafer hybrid bonding (allowing interconnects well below 1µm, down to 400nm pitch (as presented at IEDM 2023 ...
Há 3 dias · Imec is developing a process flow for direct die-to-wafer hybrid bonding at interconnect pad pitches well below 10µm, down to 1µm. To reach these goals, imec achieved a major process improvement, in particular preserving ultraclean surfaces during processing, die singulation and pick-and-place; and maintaining a high throughput during all the process steps.
Há 3 dias · The IC’s design caters to distinct functionalities like amplification, signal manipulation, logic procedures, or data retention. The primary attribute distinguishing an integrated circuit is its aptitude for consolidating myriad electronic constituents and their interconnections onto an individual chip.
