Resultado da Busca
7 de mai. de 2024 · Fig. 1: Interconnect, contact and transistor at various nodes. Source: Applied Materials. The IC design flows for digital, analog, and mixed signal chips differ in how they deal with the two main design steps: functional design and verification; physical design and verification
Há 4 dias · AMD 3D IC Devices; Virtex UltraScale+: XCVU5P: XCVU7P: XCVU9P: XCVU11P: XCVU13P: XCVU19P: XCVU27P: XCVU29P: XCVU31P: XCVU33P: XCVU35P: XCVU37P: XCVU45P: XCVU47P: XCVU57P: Virtex UltraScale: XCVU125: XCVU160: XCVU190: XCVU440 Kintex UltraScale: XCKU085: XCKU115 Virtex 7 T: 7V2000T Virtex 7 XT: 7VX1140T
29 de abr. de 2024 · Through-silicon vias (TSVs) for 3D integration are superficially similar to damascene copper interconnects for integrated circuits. Both etch the via, into either silicon or a dielectric, line it with a barrier against copper diffusion, then deposit a seed layer prior to filling the via with copper using some form of aqueous deposition.
Há 2 dias · As a one-stop powerhouse for advanced interconnect solutions, from chip packaging, IC substrate, advanced PCB, to assembly, we are well equipped to enable our customers to push the boundaries in ...
Há 5 dias · Overview. The Interconnect Focus Center (IFC) conducts research to discover and invent new electrical, optical and thermal interconnect solutions that will enable hyper-integration of heterogeneous components for future terascale systems.
Há 2 dias · DuPont™ Riston® DI1600 & DI1600M dry film photoresist are advanced photoresist solutions that enable fine line direct imaging for IC substrate applications. They offer exceptional fine line adhesion and resolution, combined with high-yield performance, making them the ideal choice for advanced IC substrate production.
26 de abr. de 2024 · Silicon Photonics. TSMC Symposium 2024. COUPE. 3D Optical Engine. 9 Comments + Add A. Comment. Optical connectivity – and especially silicon photonics – is expected to become a crucial...
