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Há 1 dia · In glass-based 3-D integrated circuits (ICs), nonuniform through-glass vias (TGVs) contribute to increased delay, higher losses, and performance degradation, particularly notable in dense multilayer stacked circuits operating at high frequencies. To explore high-speed, low-loss vertical interconnections, we develop nonuniform TGVs double-layer vertical interconnect models and analyze impedance ...
8 de mai. de 2024 · Nature - Electro-optical photonic integrated circuits based on lithium tantalate perform as well as current state-of-the-art ones using lithium niobate but the material has the advantage of...
- Chengli Wang
7 de mai. de 2024 · The three main types of integrated circuits are analog, digital, and mixed signal circuits. Integrated circuits may be monolithic — one piece of silicon, where components are added in one layer, or they may be more complex, such as chiplets that have more than one piece of silicon.
23 de mai. de 2024 · Abstract. The continuous growth in data volume has sparked interest in silicon-organic-hybrid (SOH) nanophotonic devices integrated into silicon photonic integrated circuits (PICs). SOH devices...
11 de mai. de 2024 · As the core part of packaging, interconnect technology is responsible for connecting various components inside the chip to each other and for exchanging signals and power with the outside systems. Interconnect technologies continue to evolve as the speed, density and functionality of semiconductor products increase.
Há 4 dias · Research in Interconnect addresses the following six themes: Electrical Interconnects; Optical Interconnects; Thermal Dissipation and Power Management; Circuit and System Design and Modeling; Driver I: High Performance Network Routing/Computing Chip; Driver II: Low-Power Platform for Integration of New Materials and Functions; Center ...
Há 3 dias · Silicon Photonics is a combination of two of the most important inventions of the 20th century—the silicon integrated circuit and the semiconductor laser. It enables faster data transfer over longer distances compared to traditional electronics, while utilizing the efficiencies of Intel’s high-volume silicon manufacturing.
