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  1. Há 4 dias · Interconnect and packaging technologies are crucial aspects of modern electronics, and they are essential to achieve high performance, miniaturization and low power consumption of electronic equipment . With the rapid development of semiconductor processes, interconnect and packaging technologies continue to evolve to meet growing market demands.

  2. Há 1 dia · Chiplet technology revolutionizes semiconductor design by disaggregating monolithic integrated circuits into modular components called chiplets. These chiplets offer advantages such as enhanced design flexibility, scalability, and performance. Interconnect technologies enable efficient communication between chiplets, while heterogeneous integration allows diverse components to be combined into ...

  3. Há 15 horas · High-density interconnect technologies include microfabrication, multilayer design and packaging, which play a key role in realizing smaller, higher-performance electronics. I. Microminiature Circuits: Enabling High Density Connections Between Electronic Components. Microfabrication is an important part of high-density interconnect technology.

  4. Há 1 dia · POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced that Foxconn Interconnect Technology (“FIT”), a market leader of interconnect solutions for communication infrastructure and several other large, high-growth markets, has ...

  5. Há 2 dias · SHANGHAI, China, May 13, 2024 – DuPont today announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai.

  6. Há 1 dia · About Foxconn Interconnect Technology (”FIT“): FIT Hon Teng Limited (6088.HK) focuses on precision design and manufacturing of connector products as its core.

  7. Há 1 dia · POET Announces Design Win and Collaboration with Foxconn Interconnect Technology for High-speed AI Systems TORONTO, May 14, 2024 (GLOBE NEWSWIRE) - POET Technologies Inc. (“POET” or the ...