Resultado da Busca
POWER7 is a family of superscalar multi-core microprocessors based on the Power ISA 2.06 instruction set architecture released in 2010 that succeeded the POWER6 and POWER6+. POWER7 was developed by IBM at several sites including IBM's Rochester, MN ; Austin, TX; Essex Junction, VT ; T. J. Watson Research Center , NY; Bromont, QC [1 ...
- 2010
- IBM
- 2.4 GHz to 4.25 GHz
IBM states that it is two to three times as fast as its predecessor, the POWER7. It was first built on a 22 nanometer process in 2014. In December 2012, IBM began submitting patches to the 3.8 version of the Linux kernel, to support new POWER8 features including the VSX-2 instructions. POWER9
PowerPC (with the backronym Performance Optimization With Enhanced RISC – Performance Computing, sometimes abbreviated as PPC) is a reduced instruction set computer (RISC) instruction set architecture (ISA) created by the 1991 Apple – IBM – Motorola alliance, known as AIM.
- October 1992; 31 years ago
- AIM
- 2.02
POWER7, 64-bit octo core, 4 way SMT/core, 2.4–4.25 GHz, follows the Power ISA 2.06. Introduced in 2010. POWER7+ , 64-bit octo core, 4 way SMT/core, 3.0–5.0 GHz, follows the Power ISA 2.06.
Referências. POWER4 é uma CPU que implementa a arquitetura de 64 bits do PowerPC. Lançado em 2001, o POWER4 é baseado no projeto anterior POWER3. O POWER4 é multinúcleo, tendo 2 núcleos PowerPC. Funcionalidade. A unidade funcional do POWER4™ consiste de 2 implementaçõeos de 64 bits da arquitetura PowerPC AS.
The PowerPC 7xx is a family of third generation 32-bit PowerPC microprocessors designed and manufactured by IBM and Motorola (spun off as Freescale Semiconductor bought by NXP Semiconductors ). This family is called the PowerPC G3 by Apple Computer (later Apple Inc. ), which introduced it on November 10, 1997.
For most workloads, the chip is said to perform two to three times as fast as its predecessor, the POWER7. POWER8 chips comes in 6- or 12-core variants; each version is fabricated in a 22 nm silicon on insulator (SOI) process using 15 metal layers.
