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1. www.pcbdirectory.com › manufacturer › profileFlex Interconnect Technologies - Profile on PCB Directory

   www.pcbdirectory.com › manufacturer › profile

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   Flex Interconnect Technologies. (0 reviews) United States, California, Milpitas. +1-408-635-3544. 1603 Watson Court Milpitas, CA 95035. AS9100, ISO 9001, ITAR. Visit Website. Flex Interconnect Technologies is the leader in flexible printed circuit technologies and can provide solutions to your interconnect problems.

2. www.semanticscholar.org › paper › Recent-advance-inRecent advance in non-Krylov subspace model order reduction ...

   www.semanticscholar.org › paper › Recent-advance-in

   1 de abr. de 2010 · DOI: 10.1016/S1007-0214(10)70045-6 Corpus ID: 61010388; Recent advance in non-Krylov subspace model order reduction of interconnect circuits @article{Tan2010RecentAI, title={Recent advance in non-Krylov subspace model order reduction of interconnect circuits}, author={Sheldon X.-D. Tan and Boyuan Yan and Hai Wang}, journal={Tsinghua Science \& Technology}, year={2010}, volume={15}, pages={151 ...

3. www.oracle.com › cloud › azureOCI Azure Interconnect | Oracle

   www.oracle.com › cloud › azure

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   Every interconnect circuit (ExpressRoute and FastConnect) comes with a redundant circuit on the same POP but a different physical router, providing high availability. The cost of Azure ExpressRoute varies across regions. Oracle recommends using the Local setting, which has no separate ingress or egress charges.

4. www.researchgate.net › publication › 372510753_AA Fast Electrothermal Response Analysis Method for ...

   www.researchgate.net › publication › 372510753_A

   1 de jul. de 2023 · Request PDF | A Fast Electrothermal Response Analysis Method for Interconnect Circuits With Multi-Excitations in Multilayer Packages | The design of package interconnects is increasingly vital as ...

5. onlinelibrary.wiley.com › doi › fullLiquid Metal‐Based High‐Density Interconnect Technology for ...

   onlinelibrary.wiley.com › doi › full

   29 de dez. de 2023 · High-density interconnect (HDI) technology for liquid metal (LM)-based stretchable printed circuit boards is crucial for expanding their applicability. HDI technology provides high-resolution multilayer circuits with a high density of components, as required for next generation of neuroprobes and ultrasonic and sensor arrays.

6. ieeexplore.ieee.org › document › 839662A method for reduced-order modeling and simulation of large ...

   ieeexplore.ieee.org › document › 839662

   The continuous improvement in the performance and the increases in the sizes of VLSI systems make electrical interconnect and package (EIP) design and modeling increasingly more important. Special software tools must be used for the design of high-performance VLSI systems. Furthermore, larger and faster systems require larger and more accurate circuit models. The partial element equivalent ...

7. link.springer.com › article › 10An innovative interconnect structure with improved Elmore ...

   link.springer.com › article › 10

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   22 de mar. de 2022 · An optimized Elmore delay calculation was performed for uniform and non-uniform wires to reduce the time constant of the interconnect circuits. Further, the proposed model is estimated and verified theoretically. A new improved RC model is compared to the designed π-model that shows remarkable results.